| • |
Power system design and assembly |
| • |
Breadboard and prototype development |
| • |
Engineering unit assembly |
| • |
Production assembly utilizing |
| |
| - |
Through-hole assembly |
| - |
Surface mount assembly |
| - |
Thick-film hybrid assembly |
|
| • |
DC inputs and outputs |
| • |
Telemetry control circuitry |
| • |
Mechanical design of enclosure,
interconnects, power and thermal management |
| • |
Input and output EMI filtering to MIL-STD 461C-E
and DEF STAN 59-41 requirements |
| • |
Spike and transient suppression to MIL-STD 704A,
1275A and DEF STAN 61-5 requirement |
| • |
High power conversion efficiency |
| • |
Low profile and light weight |
| • |
High power density |
| • |
Radiation hardening* |
| • |
Wide -55°C to +125°C operating temperatures |
| • |
Excellent thermal management |